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This product complies with the RoHS Directive (EU 2002/95/EC).
Light Emitting Diodes
LN217RPH
Square Type
5.3 mm x 1.8 mm Absolute Maximum Ratings Ta = 25C
Parameter Power dissipation Forward current Pulse forward current * Reverse voltage Operating ambient temperature Storage temperature Symbol PD IF IFP VR Topr Tstg Rating 70 25 150 4 -25 to +85 -30 to +100 Unit mW mA mA V C C
Lighting Color
Red
Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.
Electro-Optical Characteristics Ta = 25C
Parameter Luminous intensity Reverse current Forward voltage Peak emission wavelength Spectral half band width IO I F Symbol IO IR VF P VR = 4 V IF = 20 mA IF = 20 mA IF = 20 mA IF VF 2.2 700 100 Relative luminous intensity Ta Conditions Min 0.3 Typ 0.6 5 2.8 Max Unit mcd A V nm nm
10
100
1000
3
Forward current IF (mA)
5
50 30
Relative luminous intensity (%)
1.6 1.8 2.0 2.2 2.4
Luminous intensity IO (mcd)
500 300
1 0.5 0.3
10 5 3
100 50 30
0.1 1
3
5
10
30
50
100
1
10 -20
0
20
40
60
80
100
Forward current IF (mA)
Forward voltage VF (V)
Ambient temperature Ta (C)
Relative luminous intensity (%)
Relative luminous intensity P
100 80 60 40 20 0 500 600 700 800 80 90 100 80 60 40 20 40 50 60 70
IF Ta
50
Directive characteristics
30 20 10 0 80 60 40 20 0 20 40 60 80 10 20 30 40 50 60 70
80
Forward current IF (mA)
40 30 20 10 0
90 100
0
20
40
60
80
100
Peak emission wavelength P (nm)
Relative luminous intensity (%)
Ambient temperature Ta (C)
Publication date: November 2008
SHD00457BEK
1
This product complies with the RoHS Directive (EU 2002/95/EC).
LN217RPH
Package (Unit: mm)
LLXFTN2SF170
2.0 Max. NOT SOLDERED
5.5 0.2 5.3 0.2
4.0 0.2
2.0 0.2 1.8 0.2
0.6
1.5
2 - 0.8 Max 2 - 0.6 0.1
0. 5 4.85 2.0 6 .0 5.35 0.3 28.0 1.0 8.0 0.2
0.8
1.5
0.6 0.1
1.5
1
2
2.54
name Pin 1: Anode 2: Cathode
2
SHD00457BEK
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805

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